The Microscopy business group at Carl Zeiss is presenting the new AURIGA Compact FIB-SEM at the China International Advanced Materials Industry Technology & Laboratory Equipment (Ciamite) in Beijing.
The system generates high-resolution three dimensional images and analyses, and enables precise materials processing.
The FIB-SEM opens the door to the 3D-nanoworld with CrossBeam technology.
AURIGA Compact is used in various industrial sectors for 3D analysis and imaging, TEM lamella preparation, materials processing and nano-structuring.
AURIGA Compact offers outstanding resolution even at low accelerating voltages, thus enabling high-resolution imaging of various specimens in all three dimensions.
Local charge compensation also enables the artifact-free display of non-conductive, self-charging samples. AURIGA Compact is available with a combined In-lens detector.
In addition to the detection of secondary electrons (SE) which ensure high topography contrast, backscatter electrons (EsB) can be detected based on their energy. This results in very good material contrast.
Ingo Schulmeyer, Product Manager for CrossBeam systems at Carl Zeiss, is optimistic: "With the AURIGA Compact, Carl Zeiss is bringing to market a system that combines the reliable and advanced CrossBeam technology in an easy-to-use configuration. The outstanding value for the money opens up new opportunities for users who have been limited to SEM imaging until now. They can now add three-dimensional analysis and processing methods to their range of applications with proven ZEISS quality."
AURIGA Compact can be extended with numerous analysis and processing options, such as the high-end ATLAS 3D tomography package which enables the fast capture of three-dimensional image stacks with resolution of up to 32k x 32k pixels.