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ZEISS Presents New Products and Solutions at Microscopy & Microanalysis 2020 Virtual Meeting
Product News

ZEISS Presents New Products and Solutions at Microscopy & Microanalysis 2020 Virtual Meeting

ZEISS Presents New Products and Solutions at Microscopy & Microanalysis 2020 Virtual Meeting
Product News

ZEISS Presents New Products and Solutions at Microscopy & Microanalysis 2020 Virtual Meeting


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ZEISS experts have presented new products and solutions at its virtual booth for the Microscopy & Microanalysis 2020 Virtual Meeting. Available beginning on August 4th, the meeting’s first exhibit day, the ZEISS booth highlighted the Crossbeam family of FIB-SEM products, ZEISS SolutionLab rapid application development, and two additions to the Advanced Reconstruction Toolbox for ZEISS Xradia 3D X-ray microscopes: OptiRecon for iterative reconstruction and DeepRecon for deep learning-based reconstruction.

The ZEISS Crossbeam family of products combines the imaging and analytical performance of a high-resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation focused ion beam (IonSculptor FIB) for high throughput 3D analysis and sample preparation. The newly introduced, patented ZEISS Crossbeam laser, a next generation femtosecond laser ablation module, is available on ZEISS Crossbeam 350/550 to enable the access of deeply buried structures in addition to rapid, gallium-free structure fabrication over large length scales. The combined capabilities of a FIB-SEM with femtosecond laser ablation enhances efficiency in multi-scale and multi-modal workflows, providing material modification and characterization spanning from the millimeter scale to nanometer scale in an integrated and coordinated platform. 

Additionally, ZEISS has introduced enhanced workflows for 3D FIB-SEM tomography to ensure class leading volumetric data generation. An update of the hardware and software package ZEISS Atlas 5 has been designed to improve 3D analysis in static EBSD (electron backscatter diffraction) acquisition, correlative workflows, and definition of tomographic slice thickness. This so-called “True Z technology” ensures high quality FIB-SEM tomography by using calibrated and precisely quantified measurement of z-slice thickness throughout the tomography acquisition run.   The measurement of each individual slice thickness is then used in turn to reconstruct the tomogram accounting for small variability in slice dimensions, resulting in a near-perfect three-dimensional volume.

Introducing SIMS (Secondary Ion Mass Spectrometry) solutions for elemental analysis across the ZEISS Crossbeam family has added a significant analytical capability to ZEISS ion beam microscopes. This is enhanced with the new ToF-SIMS (Time-of-Flight) detection introduced for both Crossbeam 350 and Crossbeam 550.

New at this year’s M&M is the Advanced Reconstruction Toolbox for ZEISS Xradia 3D X-ray microscopes, which is being introduced with two new reconstruction capabilities: OptiRecon for iterative reconstruction and DeepRecon for deep learning-based reconstruction.  These approaches to tomographic reconstruction provide X-ray microscopy users with opportunities to both improve scan throughput as well as enhance image quality by reducing artifacts and noise and enhancing subtle image features.

Also being previewed is the ZEISS SolutionLab, a rapid applications development initiative combining hardware and software for targeted microscopy workflows.  Such an approach is provided to meet specific application needs not easily satisfied by standard products, and thus requiring a customizable approach. The new ZEISS SolutionLab enables ZEISS and microscopy users to work in partnership to find innovative solutions to challenging problems.

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