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Bruker Announces Three Next-Generation Semiconductor Metrology Products
Product News

Bruker Announces Three Next-Generation Semiconductor Metrology Products

Bruker Announces Three Next-Generation Semiconductor Metrology Products
Product News

Bruker Announces Three Next-Generation Semiconductor Metrology Products


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At SEMICON West 2012, Bruker has announced three new 450mm X-Ray and AFM semiconductor metrology products to support the industry's transition to larger wafer production.

These new products include the InSight-450 3DAFM from Bruker's Nano Surfaces division and both the next generation of the D8 FABLINE and the new S8 FABLINE-T X-ray systems from Bruker's AXS division.

All three metrology systems are designed to meet the industry roadmap challenges at future technology nodes on the larger 450mm wafer size, enabling both greater product capability and reliability for semi development and production facilities.

Eliminating the need for model setup, and providing TEM-like accuracy in fractions of the time without wafer damage, Bruker's automated atomic force microscopes (AFMs) have proven essential tools for critical technology development and continued process control in production since 200mm wafer development.

Similarly, Bruker's X-ray metrology has a long tradition of providing a reliable, accurate and non-contact method of characterizing various essential semi parameters without the need to use a reference.

The wafer size transition from 300mm to 450mm represents another critical technology inflection point that is now supported by Bruker's core metrology technologies.

"Bruker's significant commitment to the SEMI industry is embodied in these three exciting new 450mm-compatible products," stated Bruker AXS division president Dr. Frank Burgäzy.

Dr. Burgäzy continued, "Both X-Ray and high-resolution AFM technologies have been identified by the 2011 International Technology Roadmap as critical for the success of future semiconductor technology nodes, and Bruker is uniquely placed with our technologies to address these future needs. We are very pleased to be part of this critical wafer size transition, and feel that these systems are another indication of our continuing determination to enable the steady advance of semiconductor technology with production-worthy X-ray and AFM metrology solutions."

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