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ASM Introduces New High Productivity Epitaxy, PEALD and PECVD Systems
Product News

ASM Introduces New High Productivity Epitaxy, PEALD and PECVD Systems

ASM Introduces New High Productivity Epitaxy, PEALD and PECVD Systems
Product News

ASM Introduces New High Productivity Epitaxy, PEALD and PECVD Systems

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ASM International N.V. has launched two new advanced deposition systems.

The new systems deliver industry-leading process performance for epitaxy, plasma enhanced atomic layer deposition (PEALD) and plasma enhanced chemical vapor deposition (PECVD), targeting 300 mm high volume manufacturing (HVM).

First, the company introduced the Intrepid™ XP, a single wafer Epi process tool that can be configured with up to four epitaxy reactor modules.

The Intrepid™ XP deposits advanced strained silicon based Epi films that are used to lower power consumption in CMOS transistors at 20nm and beyond.

"Intrepid™ combines our advanced and proprietary transistor Epi technology that we have been developing in recent years, with ASM's multi-chamber XP platform. We have improved every aspect of ASM's pioneering Epi equipment and created a tool extendible to future 3D transistor technologies" said Peo Hansson, General Manager of ASM's Thermal Products Business Unit.

Second, ASM also introduced its XP8 system, a high productivity single wafer process tool, for both PEALD and PECVD applications.

XP8 accommodates up to 8 chambers for PEALD or PECVD, which can also be integrated together on the same platform.

"As more layers require the control and conformality of PEALD, as well as the high throughput of PECVD, the high productivity of the XP8 is critical to ensure our customers maintain acceptable cost per wafer," said Tominori Yoshida, general manager of ASM's Plasma Products Business Unit.

PEALD and PECVD chambers can be clustered on the XP8 to target double and quadruple patterning spacers, low-k, and other applications.

"ASM has been recognized for bringing to market innovative process technologies that drive next-generation devices," said Chuck del Prado, President and Chief Executive Officer of ASM International.

Prado continued, "At the same time, manufacturability and productivity are key requirements for wide-scale adoption of these process innovations. The new systems released on our XP and XP8 platforms complement our leadership in process performance with high productivity."