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FEI Releases New Helios NanoLab G3 DualBeam
Product News

FEI Releases New Helios NanoLab G3 DualBeam

FEI Releases New Helios NanoLab G3 DualBeam
Product News

FEI Releases New Helios NanoLab G3 DualBeam

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FEI has announced the release of the next generation of its industry-leading Helios NanoLab™ DualBeam™. The Helios NanoLab G3 DualBeam extends the Helios family’s leadership position with unmatched image contrast and resolution, while at the same time, adding a new, easy-to-use user interface.

The new Helios comes in two different workflow-specific configurations for materials science research. It will be featured in the FEI booth at the International Microscopy Congress, September 7-12, in Prague, Czech Republic.

“The Helios NanoLab G3 DualBeam continues FEI’s well-established leadership in DualBeam instrumentation, building on a long history of performance and innovation from the first commercial DualBeam, which FEI launched more than 20 years ago, to the Helios PFIB™ DualBeam just announced at the Microscopy and Microanalysis show last month,” said Trisha Rice, vice president and general manager of Materials Science for FEI.

Rice continued, “This third generation of the Helios family continues to provide the high resolution and strong image contrast that the family is known for, but adds a new interface that can actually guide the user through typical operations. We have optimized each of the configurations for a particular class of workflows, based on customer feedback and our long and deep involvement in DualBeam analysis.”

The DualBeam instruments’ ability to see structure and composition and add and remove material at the nanometer scale allows materials scientists to explore fundamental relationships between structure and function and prepare ultrathin samples for atomic scale analysis in transmission electron microscopes (TEM).

The CX configuration of the Helios NanoLab G3 DualBeam includes more versatile sample handling and positioning for fast, flexible analysis, sample preparation and characterization.

The UC configuration delivers the ultimate imaging capability with increased sensitivity to surface detail and improved performance on soft, non-conductive or beam-sensitive materials.