GenISys GmbH, a provider of software for optimization of microstructure fabrication processes, has announced it has signed an agreement with the Fraunhofer Institute of Integrated Systems and Device Technology (IISB) for the development and licensing of advanced 3-D resist modeling techniques for e-beam and proximity lithography.
GenISys further announced that Nikola Belic, a pioneer in proximity effect correction (PEC) technology and developer of the widely used Proxecco PEC software, will join GenISys as senior development engineer, effective January 2008.
According to the terms of its agreement with Fraunhofer IISB, GenISys will integrate the 3-D resist modeling technologies developed by Fraunhofer IISB’s Lithography Simulation Group under the direction of Dr. Andreas Erdman into GenISys’ products for proximity lithography for microsystems and e-beam lithography, and market them.
Insofar, GenISys will be the sole software house partner for IISB regarding distribution. Specifically, GenISys will adapt and integrate Fraunhofer’s 3-D resist modeling technologies into its Layout LAB mask-aligner lithography simulation software and its Layout BEAMER e-beam data preparation and PEC software.
“We decided to leverage Fraunhofer’s almost 20 years of experience and proven expertise in resist modeling for advanced projection lithography honored by working with the industry’s leading IC manufacturers,” said Ulrich Hofmann, founder and general manager of GenISys.
“With Fraunhofer’s proven 3-D resist simulation technology, our products will give our customers unprecedented accuracy for modeling and optimizing their layouts and processes. The full, 3-D model will help them to more effectively correct for the limitations of the exposure process. This, in turn, will enable them to cut development time and costs even more, so they can stay ahead of their competition by bringing the latest micro and nano products to market faster and more economically.”
“We are delighted that Nikola has chosen to bring his unparalleled expertise in PEC to GenISys,” Hofmann continued.
“As the leading developer behind Proxecco, Nikola brings a wealth of knowledge and insight into both the technology and the market. This is growing increasingly important as chip geometries continue to shrink, and chipmakers have to find new ways to build more features in less space. At GenISys, Nikola will have the opportunity to pursue new approaches and methodologies in technologies needed for next-generation devices.”