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New Advances in Rheometry - Controlled Stress Parallel Superposition for Screen Printing Applications

Webinar

 
New Advances in Rheometry - Controlled Stress Parallel Superposition for Screen Printing Applications
 

This live webinar will discuss the application of an advanced rheometric technique known as Controlled Stress Parallel Superposition (CSPS) to model screen printing inks and gelling materials. The theoretical background to CSPS will be discussed along with the challenges which must be overcome when applying the technique to materials with complex and/or transient microstructures. Validation data will be presented before the use of CSPS in the context of printed electronics is explored. The webinar targets those interested in understanding the rheological properties of materials with shear sensitive microstructures. Special attention will be given to gelling materials and screen-printing functional inks.#

Speaker:

Dr Alex Holder attended Chemical Engineering at Swansea University and joined the Welsh Centre of Printing and Coating after completing his PhD in Nanotechnology. As a PhD student, he worked on validating advanced rheometric techniques such as Optimal Fourier Rheometry (OFR) and controlled stress parallel superposition (CSPS) while working closely with industrial partners on how these techniques might provide better data for their flow modelling. During his time at the WCPC, Alex was involved in the development of printed pressure sensors as well as developing advanced rheometric techniques to investigate fluid properties specifically of interest to printing. After a collaborative research project with the Complex Fluids Research Group at Swansea University Alex has returned to the WCPC and seeks to utilise advanced rheometric techniques to further understanding in the field of printed electronics as well as other complex biological and industrial rheological systems.

 
 
 
 

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